Innovate to solve the world's most important challenges

Join a team that develops next-gen products in the field of micro-electrical and micro-optical mechanical systems (MEMS and MOEMs) for Honeywell Aerospace's Advanced Technology division. Work with highly skilled engineers and technicians in a state-of-the-art process lab developing and characterizing new sensors for aerospace applications. Contribute to business growth by proposing new research ideas and exploring innovative process techniques. The ideal candidate will have a broad understanding of materials and fabrication on silicon wafers, will effectively be able to lead a team of process lab technicians, and will have intimate knowledge of the workings of the machinery which comprise a process lab.

You will develop new products and processes in support of the organization's business strategies in cutting-edge technology development. Use wafer fabrication experience and skills for new business opportunities, products and processes in an R&D environment. Areas of concentration will include process integration and metrology techniques specific to micromachining such as e-beam lithography, LPCVD, photolithography, DRIE, ICP etching, PECVD, wafer bonding, lithography, ALD, electroplating, CVD & PVD techniques, profilometry, ellipsometry, SEM, and others.

In this role you will:

• Design and execute microfabrication experiments to improve on processes and to support new technology development
• Collaborate with technicians, design, manufacturing and budgeting teams to provide creative solutions to meet product requirements and enhance technology readiness of an ever-evolving advanced technology portfolio
• Monitor and analyze data to fix yield, performance and reliability issues
• Propose novel products, devices, and solutions to meet R&D customer's requirements

Compensation & Benefits:
Non-Incentive
The annual base salary range for this position is $105,000 - $126,00. Please note that this salary information serves as a general guideline. Honeywell considers various factors when extending an offer, including but not limited to the scope and
responsibilities of the position, the candidate's work experience, education and training, key skills, as well as market and business considerations.

For benefits information, please visit https://careers.honeywell.com/us/en/honeywell-benefits. Current employees may visit HR Direct.

U.S. PERSON REQUIREMENTS

Due to compliance with U.S. export control laws and regulations, candidate must be a U.S. Person, which is defined as, a U.S. citizen, a U.S. permanent resident, or have protected status in the U.S. under asylum or refugee status.

YOU MUST HAVE

• Bachelor's degree from an accredited institution in a technical discipline such as the sciences, technology, engineering or mathematics
• 5 years hands-on experience in wafer micro-fabrication techniques (PhD inclusive)

WE VALUE

• Bachelor's degree in electrical engineering, microelectronics, electronics, material science, physics, mechanical engineering or chemistry engineering
• Ph.D. or Masters in electrical engineering, microelectronics, electronics, material science, physics, mechanical engineering or chemistry engineering
• MEMS and/or CMOS fabrication experience
• Experience with integrated waveguides and photonic elements
• Experience with furnaces for diffusion and LPCVD

Additional Information

• JOB ID: HRD261219
• Category: Engineering
• Relocation Tier: Not Applicable
• Security Clearance:
• Aviation Authority (FAA for US):
• Band: 03
• Referral Bonus: 1500
• Requisition Type: Standard Requisition
• US Citizenship: Due to US export control laws, must be a US citizen, permanent resident or have protected status.
• FLSA Statement:
• FLSA CODE: Exempt

Honeywell is an equal opportunity employer. Qualified applicants will be considered without regard to age, race, creed, color, national origin, ancestry, marital status, affectional or sexual orientation, gender identity or expression, disability, nationality, sex, religion, or veteran status.